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  • THROUGH SILICON VIAS
    BRAJESH KUMAR KAUSHIK / VOBULAPURAM RAMESH KUMAR / MANOJ KUMAR MAJUMDER / ARSALAN ALAM
    Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different ...

    $1,380.00