Búsqueda de LIBROS DEL AUTOR: wong e h

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  ebook

  ROBUST DESIGN OF MICROELECTRONICS ASSEMBLIES AGAINST MECHANICAL SHOCK, TEMPERATURE AND MOISTURE: EFFECTS OF TEMPERATURE, MOISTURE AND MECHANICAL DRIVING FORCES

  WONG, E-H / MAI, Y.-W.

  Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeli...

  $2,659.00

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