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  MODELING AND DESIGN OF ELECTROMAGNETIC COMPATIBILITY FOR HIGH-SPEED PRINTED CIRCUIT BOARDS AND PACKAGING

  XING-CHANG WEI

  Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The...

  $1,280.00

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