Developments in the Collision and Grounding of Ships and Offshore includes the contributions to the 8th International Conference on Collision and Grounding of Ships and Offshore Structures (ICCGS 2019, Lisbon, Portugal, 21-23 October 2019). The series of ICCGS-conferences started in 1996 in San Francisco, USA, and are organised every three years in Europe, Asia and the Americas. Developments in the Collision and Grounding of Ships and Offshore covers a wide range of topics, from the behavior of large passenger vessels in collision and grounding, collision and grounding in arctic conditions including accidental ice impact, stability residual strength and oil outflow of ships after collision or grounding, collision and grounding statistics and predictions and measures of the probability of incidents, risk assessment of collision and grounding, prediction and measures for reduction of collision and grounding, new designs for improvement of structural resistance to collisions, analysis of ultimate strength of ship structures (bulkheads, tank tops, shell etc.), design of buffer bows to reduce collision consequences, design of foreship structures of ferries with doors to avoid water ingress in case of a collision, development of rational rules for the structural design against collision and grounding, innovative navigation systems for safer sea transportation, the role of IMO, classification societies, and other regulatory bodies in developing safer ships, collision between ships and offshore structures, collision between ships and fixed or floating bridges and submerged tunnels, collision with quays and waterfront structures, collision and grounding experiments, properties of marine-use materials under impact loadings, residual strength of damaged ships and offshore structures, analysis of ultimate strength of ship structures, to human factors in collision and grounding accidents. Developments in the Collision and Grounding of Ships and Offshore is a valuable resource for academics, engineers and professionals involved in these areas.
